Image Sensor Modification
Providing advanced image sensor customization for a range of high-performing imaging systems.
Image Sensor Services
Working within our controlled manufacturing environments , we help customers develop bespoke sensor solutions where off-the-shelf configurations won't suffice.
Capabilities
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Cover glass removal
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Microlens removal
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Custom filter installation
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Fiber optic bonding
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Direct optical assembly integration
Sensor Modification Capabilities
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Cover Glass Removal
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Microlens Removal
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Custom Filter Installation
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Fiber Optic Bonding
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Assembly Integration
Cover Glass Removal
The protective cover glass can be carefully removed from compatible image sensors, providing direct access to the sensor surface and enabling further customization.
Cover glass removal can be used to:
- Reduce unwanted optical interfaces
- Improve coupling efficiency
- Enable direct filter integration
- Prepare sensors for specialized optical assemblies
- Support fiber optic or custom optics bonding
Replacement cover glass options may also be available where required.
Microlens Removal
For selected sensor types, the microlens array can be precisely removed to support specialized imaging applications.
Microlens removal may benefit applications requiring:
- Direct optical coupling
- Modified spectral response
- Enhanced integration with custom optical systems
- Alternative sensor architectures
Our team can advise on sensor compatibility and performance considerations.
Custom Filter Installation
Leveraging our in-house lithography capabilities, we can install and bond micropatterned optical filters directly above the image plane.
Bringing filters closer to the sensor surface can improve optical performance while enabling highly customized sensing solutions.
Available filter customizations include:
- Pixel-level multispectral filters
- RGB colour gel filters
- Bayer filter patterns
- Stripe filter configurations
- Application-specific custom filter designs
Fibre Optic Bonding
Following cover glass removal, fiber optic components can be bonded directly to the image sensor.
This capability supports applications requiring:
- Efficient light transfer
- Compact optical system design
- Fibre-coupled sensing architectures
- Custom spectroscopy and photonics systems
Optics and Optical Assembly Integration
Custom optics and optical assemblies can be directly bonded to the image sensor after cover glass removal, enabling highly integrated imaging solutions.
Examples include:
- Micro-optics
- Custom lens assemblies
- Waveguides
- Photonic structures
- Application-specific optical interfaces
Direct integration can help improve optical performance, reduce package size, and create bespoke sensor architectures tailored to specific application requirements.
Discuss Your Image Sensor Needs
Talk to our engineering team about your image sensor modification project and discover how we can create a customized sensing solution for your application.